Takehisa Tsujimura
5Patents
5h-index
7Co-inventors
52Inventor score
Filing activity: Oct 3, 1986 → Jan 11, 1999
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5081067A | Ceramic package type semiconductor device and method of assembling the same | Emerging Cross-Sectional Technologies | 89 | Expired |
| US5886408A | Multi-chip semiconductor device | Electricity | 65 | Expired |
| US4682207A | Semiconductor device including leadless packages and a base plate for mounting the leadless packages | Electricity | 60 | Expired |
| US5055914A | Ceramic package type semiconductor device and method of assembling the same | Emerging Cross-Sectional Technologies | 27 | Expired |
| US6143590A | Multi-chip semiconductor device and method of producing the same | Electricity | 22 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.