Device fabrication method using spin-on glass resins

US4683024A · kind A · utility

Assignee

• American Telephone and Telegraph Company, AT&T Bell Laboratories · US

Inventors

• David A. B. Miller · Baltimore, US
• Joseph M. Moran · Berkeley Heights, US
• Gary N. Taylor · Bound Brook, US

Key dates

• Filing date: Feb 4, 1985
• Grant date: Jul 28, 1987
• Expiry date: Feb 4, 2005

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S438/95
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A new method for fabricating a device, such as a semiconductor device, is disclosed. The method includes the step of patterning a substrate with a trilevel resist containing a spin-deposited substitute for the conventional central, silicon dioxide region. This substitute includes an organosilicon glass resin in combination with metal-and-oxygen containing material. The inventive method prevents the losses of linewidth control, and avoids the pattern degradation due to undesirably many pinholes, of previous such methods.