Surface mounted circuits including hybrid circuits, having CVD interconnects, and method of preparing the circuits
US4685030A · kind A · utility
16Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 1985 |
| Grant date | Aug 4, 1987 |
| Priority date | — |
| Expiry date | Apr 29, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A surface mounted circuit is disclosed. The circuit includes an insulating substrate, a chemical vapor deposited interconnect layer of conductive metal, as Cr, Fe, Co, Ni, W, Mo, Mn or mixtures thereof, and at least one circuit element. The surface mounted circuit includes an interfacial layer of W, Mo, Mn, or a mixtures thereof, chemical vapor deposition of an interconnect layer of Cr, Fe, Ni, Co, Mn, W, Mo, or mixtures thereof, and bonding of a circuit element atop the interconnect layer. Also disclosed is a support, adapted for use as a circuit board for a surface mounted circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.