Oxide-free extruded thermal joint
US4685606A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 1986 |
| Grant date | Aug 11, 1987 |
| Priority date | — |
| Expiry date | May 9, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of joining a thermally conductive element to an electric circuit chip for cooling the chip includes initial steps of forming an oxide-free preform of a fusible metal alloy by extrusion of alloy between two mold blocks or plates. During the extrusion, the oxide coating is left behind so that the extruded alloy is essentially free of oxide. The extrusion takes place at a temperature elevated to approximately the liquidus temperature of the alloy. The preform, which may be in the form of a pill or section of thin foil, is placed between interfacing surfaces of the thermally conductive element and the chip, and is then extruded along the interfacing surfaces under pressure and elevated temperature to form a thermally conductive, oxide-free bonding layer of superior thermal conductivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.