Peter A. Gruber
121Patents
24h-index
97Co-inventors
93Inventor score
Filing activity: Apr 6, 1984 → Jan 29, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5244143A | Apparatus and method for injection molding solder and applications thereof | Electricity | 186 | Expired |
| US5388635A | Compliant fluidic coolant hat | Electricity | 135 | Expired |
| US5673846A | Solder anchor decal and method | Emerging Cross-Sectional Technologies | 90 | Expired |
| US5022462A | Flexible finned heat exchanger | Electricity | 83 | Expired |
| US8987132B2 | Double solder bumps on substrates for low temperature flip chip bonding | Electricity | 74 | Active |
| US5198189A | Liquid metal matrix thermal paste | Electricity | 74 | Expired |
| US6534863B2 | Common ball-limiting metallurgy for I/O sites | Electricity | 69 | Expired |
| US5775569A | Method for building interconnect structures by injection molded solder and structures built | Electricity | 68 | Expired |
| US6231333A | Apparatus and method for vacuum injection molding | Emerging Cross-Sectional Technologies | 59 | Expired |
| US6332569A | Etched glass solder bump transfer for flip chip integrated circuit devices | Electricity | 55 | Expired |
| US6056191A | Method and apparatus for forming solder bumps | Electricity | 49 | Expired |
| US5821161A | Cast metal seal for semiconductor substrates and process thereof | Electricity | 46 | Expired |
| US6149122A | Method for building interconnect structures by injection molded solder and structures built | Electricity | 41 | Expired |
| US6452117B2 | Method for filling high aspect ratio via holes in electronic substrates and the resulting holes | Emerging Cross-Sectional Technologies | 41 | Expired |
| US6003757A | Apparatus for transferring solder bumps and method of using | Electricity | 36 | Expired |
| US6105852A | Etched glass solder bump transfer for flip chip integrated circuit devices | Electricity | 35 | Expired |
| US6527158B1 | Method and apparatus for forming solder bumps | Electricity | 34 | Expired |
| US5982038A | Cast metal seal for semiconductor substrates | Electricity | 34 | Expired |
| US4964458A | Flexible finned heat exchanger | Electricity | 33 | Expired |
| US6153505A | Plastic solder array using injection molded solder | Electricity | 29 | Expired |
| US5291371A | Thermal joint | Electricity | 28 | Expired |
| US6276596A | Low temperature solder column attach by injection molded solder and structure formed | Electricity | 26 | Expired |
| US6390439B1 | Hybrid molds for molten solder screening process | Emerging Cross-Sectional Technologies | 24 | Expired |
| US6461136B1 | Apparatus for filling high aspect ratio via holes in electronic substrates | Electricity | 24 | Expired |
| US8828860B2 | Double solder bumps on substrates for low temperature flip chip bonding | Electricity | 23 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.