Semiconductor device having radiator
US4688077A · kind A · utility
21Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 28, 1986 |
| Grant date | Aug 18, 1987 |
| Priority date | — |
| Expiry date | Jan 28, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device having a semiconductor package and a radiator. The semiconductor package houses a semiconductor chip therein. The radiator includes a pillar which has a plurality of fins thereon. One end of the pillar is bonded to the semiconductor package. A hole is formed in the other end of the pillar and extends the longitudinal direction of the pillar.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.