Aluminum circuit to be disconnected and method of cutting the same
US4691078A · kind A · utility
11Cited by
1References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 21, 1986 |
| Grant date | Sep 1, 1987 |
| Priority date | — |
| Expiry date | Jan 21, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In order to cut a portion of an aluminum interconnection to be disconnected in an aluminum circuit, the aluminum interconnection portion in the region to be cut is covered with a hydrogen-containing silicon nitride film by plasma CVD and is then irradiated with laser beams in an operating sequence consisting of three steps: the first step with relatively low power intensity and long irradiation time duration, the second step with intermediate power intensity and short irradiation time duration and the third step with relatively high power intensity and shortest irradiation time duration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.