Semiconductor device and a method of producing the same
US4691225A · kind A · utility
42Cited by
16References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 28, 1983 |
| Grant date | Sep 1, 1987 |
| Priority date | — |
| Expiry date | Jan 28, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/403
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprising a package base whose material is glass epoxy or the like, a plurality of leads which are formed in a manner to extend from the front surface to the rear surface of the package base, a semiconductor element which is fastened to the package base and which is electrically connected to the leads, and a resin which seals, at least, the semiconductor element and electrical connection parts between the element and the leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.