Gen Murakami
81Patents
28h-index
101Co-inventors
91Inventor score
Filing activity: Jan 24, 1979 → Aug 22, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4707724A | Semiconductor device and method of manufacturing thereof | Emerging Cross-Sectional Technologies | 292 | Expired |
| US6995510B2 | Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit | Electricity | 270 | Expired |
| US4301464A | Lead frame and semiconductor device employing the same with improved arrangement of supporting leads for securing the semiconductor supporting member | Electricity | 201 | Expired |
| US5332922A | Multi-chip semiconductor package | Electricity | 133 | Expired |
| US6002167A | Semiconductor device having lead on chip structure | Electricity | 121 | Expired |
| US5068712A | Semiconductor device | Emerging Cross-Sectional Technologies | 120 | Expired |
| US5184208A | Semiconductor device | Electricity | 82 | Expired |
| US4994411A | Process of producing semiconductor device | Emerging Cross-Sectional Technologies | 72 | Expired |
| US5714405A | Semiconductor device | Emerging Cross-Sectional Technologies | 70 | Expired |
| US5150193A | Resin-encapsulated semiconductor device having a particular mounting structure | Electricity | 66 | Expired |
| US5357139A | Plastic encapsulated semiconductor device and lead frame | Electricity | 54 | Expired |
| US5583375A | Semiconductor device with lead structure within the planar area of the device | Emerging Cross-Sectional Technologies | 48 | Expired |
| US4989068A | Semiconductor device and method of manufacturing the same | Electricity | 48 | Expired |
| US4951122A | Resin-encapsulated semiconductor device | Electricity | 46 | Expired |
| US5358904A | Semiconductor device | Emerging Cross-Sectional Technologies | 44 | Expired |
| US5442233A | Packaged semiconductor device and a lead frame therefor, having a common potential lead with lead portions having dual functions of chip support and heat dissipation | Emerging Cross-Sectional Technologies | 44 | Expired |
| US5095626A | Method of producing semiconductor memory packages | Emerging Cross-Sectional Technologies | 43 | Expired |
| US6031292A | Semiconductor device, interposer for semiconductor device | Electricity | 42 | Expired |
| US4691225A | Semiconductor device and a method of producing the same | Electricity | 42 | Expired |
| US5530286A | Semiconductor device | Emerging Cross-Sectional Technologies | 41 | Expired |
| US5701031A | Sealed stacked arrangement of semiconductor devices | Electricity | 39 | Expired |
| US5295297A | Method of producing semiconductor memory | Emerging Cross-Sectional Technologies | 38 | Expired |
| US6114751A | Semiconductor device and electronic device | Electricity | 38 | Expired |
| US4971196A | Surface package type semiconductor package | Emerging Cross-Sectional Technologies | 37 | Expired |
| US7317181B2 | Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit | Electricity | 35 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.