In-situ dendritic treatment of electrodeposited foil
US4692221A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 22, 1986 |
| Grant date | Sep 8, 1987 |
| Priority date | — |
| Expiry date | Dec 22, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a process and apparatus for forming in situ surface treated metal foil. The apparatus includes a cathode and anode arranged and/or shaped to define a plating region characterized by a first zone having a first interelectrode gap and a second zone having a second interelectrode gap smaller than the first interelectrode gap. It has been found that by providing such an arrangement it is possible to generate in the first zone a localized current density below the limiting current density sufficient to plate metal foil onto the cathode and to simultaneously generate in the second zone a localized current density above the limiting current density sufficient to form dendrites on the freshly produced foil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.