Semiconductor wafer surface grinding apparatus
US4693036A · kind A · utility
59Cited by
4References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 28, 1984 |
| Grant date | Sep 15, 1987 |
| Priority date | — |
| Expiry date | Nov 28, 2004 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B7/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A grinding apparatus comprising a supporting base and at least one grinding wheel assembly disposed to face to the supporting base. The supporting base includes at least one holding table and the surface of the holding table protrudes beyond the surface of the supporting base. The grinding wheel assembly includes a rotatably mounted supporting shaft and a grinding wheel mounted to the supporting shaft. At least the surface layer of the holding table is made of 2MgO.SiO.sub.2 -type ceramics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.