Disco Abrasive Systems, Ltd.
20Patents
0Active
20Granted
33Portfolio score
Filing activity: Apr 19, 1983 → Apr 26, 1988
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4688540A | Semiconductor wafer dicing machine | Performing Operations; Transporting | 76 | Expired |
| US4693036A | Semiconductor wafer surface grinding apparatus | Performing Operations; Transporting | 59 | Expired |
| US4565034A | Grinding and/or cutting endless belt | Performing Operations; Transporting | 32 | Expired |
| US4705016A | Precision device for reducing errors attributed to temperature change reduced | Physics | 30 | Expired |
| US4757550A | Automatic accurate alignment system | Physics | 29 | Expired |
| US4583325A | Grinding machine | Performing Operations; Transporting | 28 | Expired |
| US4753049A | Method and apparatus for grinding the surface of a semiconductor | Performing Operations; Transporting | 28 | Expired |
| US4558686A | Machining device equipped with blade inspecting means | Performing Operations; Transporting | 23 | Expired |
| US4481738A | Grinding machine | Performing Operations; Transporting | 23 | Expired |
| US4547998A | Electrodeposited grinding tool | Performing Operations; Transporting | 21 | Expired |
| US4720635A | Automatic accurate alignment system | Electricity | 20 | Expired |
| US4672557A | Automatic accurate alignment system | Physics | 17 | Expired |
| US4947598A | Method for grinding the surface of a semiconductor wafer | Performing Operations; Transporting | 13 | Expired |
| US4843766A | Cutting tool having concentrically arranged outside and inside abrasive grain layers and method for production thereof | Performing Operations; Transporting | 13 | Expired |
| US4696712A | Semiconductor wafer mounting and cutting system | Emerging Cross-Sectional Technologies | 12 | Expired |
| US4872289A | Cutter | Performing Operations; Transporting | 11 | Expired |
| US4603609A | Apparatus for cutting a sheet-like member applied to a surface of a semiconductor wafer | Emerging Cross-Sectional Technologies | 10 | Expired |
| US4652135A | Article holding apparatus and its use | Performing Operations; Transporting | 8 | Expired |
| US4817341A | Cutting tool having concentrically arranged outside and inside abrasive grain layers and method for production thereof | Performing Operations; Transporting | 7 | Expired |
| US4839996A | Method and apparatus for machining hard, brittle and difficultly-machinable workpieces | Performing Operations; Transporting | 6 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.