Semiconductor wafer mounting and cutting system
US4696712A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 25, 1985 |
| Grant date | Sep 29, 1987 |
| Priority date | — |
| Expiry date | Oct 25, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/30
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor wafer mounting and cutting system including a wafer mounting machine for mounting a semiconductor wafer to a frame and a wafer cutting machine for receiving the frame and the wafer mounted thereto fed from the wafer mounting machine and cutting the wafer as required. The system further includes a controlling device for forming a relative relation signal showing a relative relation between a first indication which has been or is applied to the frame and a second indication of the wafer, which wafer has been or is mounted to the frame, and memory means for memorizing the relative relation signal formed by the controlling device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.