Fixture for wave soldering packaged integrated circuits
US4700935A · kind A · utility
Inventors
Key dates
| Filing date | Feb 7, 1986 |
| Grant date | Oct 20, 1987 |
| Priority date | — |
| Expiry date | Feb 7, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S269/903
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A fixture for supporting integrated circuit packages during wave soldering of leads on the packages includes a carrier portion including two sets of orthogonal support members. The support members have formed edges for defining seats for receiving the packages. A frame cover includes appendages for engaging the packages and maintaining the packages in the seats. The arrangement of the orthogonal support members and cover appendages facilitates solder wave access to all leads of the packages and cleaning and drying of the packages. Heat transfer from the molten solder during the wave soldering procedure is minimized due to the low mass of the cover appendages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.