Inventor · Windham, NH, US

Thomas M. Goida

29Patents
9h-index
25Co-inventors
75Inventor score

Filing activity: Feb 7, 1986 → Dec 4, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US5084753A Packaging for multiple chips on a single leadframe Electricity 35 Expired
US8447057B2 Packages and methods for packaging MEMS microphone devices Electricity 23 Active
USD316955S Padlock General 21 Expired
US7871865B2 Stress free package and laminate-based isolator package Electricity 20 Active
US4700935A Fixture for wave soldering packaged integrated circuits Emerging Cross-Sectional Technologies 16 Expired
US7939916B2 Wafer level CSP packaging concept Electricity 16 Active
US9343367B2 Integrated device die and package with stress reduction features Electricity 10 Active
US9475694B2 Two-axis vertical mount package assembly Emerging Cross-Sectional Technologies 9 Active
US8723308B2 Packages and methods for packaging using a lid having multiple conductive layers Electricity 9 Active
US8624380B2 Vertical mount package for MEMS sensors Electricity 5 Active
US8946879B2 Packages and methods for 3D integration including two stacked dies with a portion of one die extending into a hole of the other die Electricity 5 Active
US9162872B2 Pre-molded MEMS device package having conductive column coupled to leadframe and cover Electricity 3 Active
US9209121B2 Double-sided package Electricity 3 Active
US7829379B2 Wafer level stacked die packaging Electricity 3 Active
US10287161B2 Stress isolation features for stacked dies Electricity 3 Active
US9698127B2 Integrated device die and package with stress reduction features Electricity 3 Active
US8174111B2 Vertical mount package for MEMS sensors Electricity 3 Active
US8779535B2 Packaged integrated device die between an external and internal housing Electricity 2 Active
US9215519B2 Reduced footprint microphone system with spacer member having through-hole Electricity 2 Active
US9079760B2 Integrated microphone package Electricity 2 Active
US9407997B2 Microphone package with embedded ASIC Electricity 2 Active
US9142470B2 Packages and methods for packaging Electricity 2 Active
US8941223B2 MEMS device package with conductive shell Electricity 1 Active
US11702335B2 Low stress integrated device package Performing Operations; Transporting 0 Active
US9533878B2 Low stress compact device packages Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.