Bath and process for electroplating tin, lead and tin/alloys
US4701244A · kind A · utility
15Cited by
20References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 28, 1985 |
| Grant date | Oct 20, 1987 |
| Priority date | — |
| Expiry date | May 28, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3473
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to the electrolytic plating of tin and lead metals and particularly to tin-lead alloys by dissolving divalent tin or lead compounds in an excess of a lower alkyl sulfonic acid or acid salt. The electrolytic bath comprises such additives as benzal acetone, benzaldehyde or derivatives thereof, aromatic pyridines; surfactants such as betaines, alkylene oxides polymers, imidazolinium compounds and quaternary ammonium salts and formaldehyde.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.