Semiconductor device and method of producing the same
US4706105A · kind A · utility
25Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 1986 |
| Grant date | Nov 10, 1987 |
| Priority date | — |
| Expiry date | Jun 13, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprising a square package body, a plurality of leads which jut out from each of four sides of the package body, a beveled portion which is formed in at least one corner of the package body, and leads which jut out from the beveled portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.