Method for densifying leadframe conductor spacing
US4711700A · kind A · utility
38Cited by
2References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 8, 1986 |
| Grant date | Dec 8, 1987 |
| Priority date | — |
| Expiry date | May 8, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadframe assembly comprises a plurality of bifurcated leads, each characterized by an inner lead end region adapted for connection to the die bond pads and an outer lead end region adapted for connection to external circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.