Planar magnetron sputtering device with combined circumferential and radial movement of magnetic fields
US4714536A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1987 |
| Grant date | Dec 22, 1987 |
| Priority date | — |
| Expiry date | Mar 31, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3408
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A planar magnetron sputtering device has an extended flat circular target source in opposed spaced parallel relationship with a generally flat article to be coated, placed within an evacuated coating chamber. Crossed electric and magnetic fields in the chamber are established in order to set up a plasma adjacent the target. The magnetic field is provided by a magnetic assembly of permanent magnets on the non-vacuum side of the target. The magnetic assembly is smaller in diameter than the target, but is mounted to a means for moving the assembly laterally over the entire area of the target. This means for moving sweeps the magnetic assembly in an eccentric path generally centered on the target center, with the path being non-reentrant and precessing about the target center with time. In this manner, the path sweeps different areas on successive rotations about the center, and a given area of target is exposed to the magnetic field at many successively different orientations. Articles are therefore coated with significantly improved uniformity and step coverage, while utilization of target material is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.