System and method for processing workpieces
US4717461A · kind A · utility
362Cited by
8References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 15, 1986 |
| Grant date | Jan 5, 1988 |
| Priority date | — |
| Expiry date | Sep 15, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/908
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of processing a plurality of semiconductor wafers from a wafer cassette including a wafer transfer housing and one or more processing chambers. A wafer is removed from its cassette and transported through the transfer housing into one or more processing chambers for etching, deposition or other such operations. The processed wafer is replaced into its cassette after being transported back through the wafer transfer housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.