Method and apparatus for rounding the edges of semiconductive wafers
US4718202A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 23, 1982 |
| Grant date | Jan 12, 1988 |
| Priority date | — |
| Expiry date | Aug 23, 2002 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B9/065
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In an apparatus for rounding the edges of semiconductive wafers, the wafers are loaded onto two parallel counter rotating screws one having a right hand thread and the other having a left hand thread. The grooves of respective ones of said screw engage the edges of the semiconductive wafer to be rounded. The grooves of the respective screws are of rounded cross-section and an abrasive slurry is introduced into the grooves to facilitate abrading of the edges of the wafers. A pressure roller engages the edges of the wafers and forces the wafers into the grooves to further facilitate rounding of the edges. Due to the action of the screws, the wafers, as they are being rounded are caused to traverse the length of the screws to provide a continuous processing of the wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.