Polyimide precursor compositions, their manufacture, the resultant polyimides and their use, particularly for manufacturing enamelling varnishes for electric wires
US4720539A · kind A · utility
18Cited by
5References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 10, 1986 |
| Grant date | Jan 19, 1988 |
| Priority date | — |
| Expiry date | Sep 10, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B3/306
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Polyimide precursor compositions are described which may be prepared by rting a biprimary aromatic diamine with a diester-diacid or an aromatic tetraacid, and then with the substantially stoichiometrical complement of an aromatic dianhydride. The polyimide precursor compositions are used in the manufacture of insulating coatings, films, impregnating or enamelling varnishes for electric wires etc., and have excellent qualities of flexibility, adhesiveness and heat resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.