Centre d'Etude des Materiaux Organiques pour Technologies Avancees
10Patents
0Active
10Granted
31Portfolio score
Filing activity: Jul 25, 1985 → Oct 17, 1990
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4720539A | Polyimide precursor compositions, their manufacture, the resultant polyimides and their use, particularly for manufacturing enamelling varnishes for electric wires | Electricity | 18 | Expired |
| US4645821A | Precursor of copolyphthalocyanine-imide lattice, preparation, and the resultant lattice | Chemistry; Metallurgy | 9 | Expired |
| US5036111A | Expanded materials with nadimide resin base | Chemistry; Metallurgy | 9 | Expired |
| US5093202A | Method of gluing substrates using a composition comprising an arylaliphatic copolyimide with ether chain formations and an epoxy resin | Emerging Cross-Sectional Technologies | 4 | Expired |
| US4987218A | Polybenzhydrol compositions ending with ethylenic unsaturated groups, cross-linked polymides resulting from their thermal polyermization and the use of said compositions | Chemistry; Metallurgy | 3 | Expired |
| US4764578A | Compositions of polyaryloxypyridine oligomers with phthalonitrile end groups, their preparation and use for manufacturing polyaryloxypyridine co-phthalocyanine lattices | Chemistry; Metallurgy | 3 | Expired |
| US4814403A | Oligomer compositions of polyaryloxypyridines with acetylenic end groups, their manufacture and lattices obtained by thermal polymerization thereof | Chemistry; Metallurgy | 3 | Expired |
| US5064934A | Thermosetting polyimide schiff base resins, their preparation and their applications | Chemistry; Metallurgy | 2 | Expired |
| US5104968A | Polyimide precursor composition and application therefrom | Emerging Cross-Sectional Technologies | 2 | Expired |
| US4931541A | Thermosetting quinazolone resins their preparation and their applications | Chemistry; Metallurgy | 0 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.