Integrated-circuit leadframe adapted for a simultaneous bonding operation
US4722060A · kind A · utility
54Cited by
16References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 22, 1984 |
| Grant date | Jan 26, 1988 |
| Priority date | — |
| Expiry date | Mar 22, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadframe for an integrated circuit includes a set of individual leads temporarily connected in an array; each lead having an exterior portion shaped in a standard form and an interior portion shaped to form a standard array of contacts and to have the same spring constant for deflections perpendicular to the plane of the leadframe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.