Molding apparatus for enclosing semiconductor chips with resin
US4723899A · kind A · utility
Inventor
Key dates
| Filing date | Nov 12, 1985 |
| Grant date | Feb 9, 1988 |
| Priority date | — |
| Expiry date | Nov 12, 2005 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C70/72
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A molding apparatus for enclosing semiconductor chips with resin has a plurality of plungers for applying pressure to a resin material, at least one transfer channel holding each of resin material supplying pots in communication with corresponding one of cavities for transferring the resin material in a molten state, a communication bore formed in the vicinity of the transfer channel in communication therewith, slide members each intimately fitting in the communication bore and slidable forward or backward, pressing-pushing members for pushing each slide member toward the corresponding transfer channel with a uniform pressure, and a pressure sensor operable by the retraction of each slide member for detecting the internal pressure of the transfer channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.