Michio Osada
24Patents
11h-index
33Co-inventors
75Inventor score
Filing activity: Oct 18, 1983 → Apr 17, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5435953A | Method of molding resin for sealing an electronic device | Electricity | 49 | Expired |
| US5834035A | Method of and apparatus for molding resin to seal electronic parts | Emerging Cross-Sectional Technologies | 49 | Expired |
| US4793785A | Apparatus of multiplunger type for enclosing semiconductor elements with resin | Performing Operations; Transporting | 34 | Expired |
| US5507633A | Resin molding apparatus for sealing an electronic device | Electricity | 22 | Expired |
| US4723899A | Molding apparatus for enclosing semiconductor chips with resin | Performing Operations; Transporting | 21 | Expired |
| US4862586A | Lead frame for enclosing semiconductor chips with resin | Emerging Cross-Sectional Technologies | 21 | Expired |
| US5603879A | Method of molding resin to seal electronic parts using two evacuation steps | Emerging Cross-Sectional Technologies | 21 | Expired |
| US5031022A | Film carrier for mounting IC chips | Electricity | 18 | Expired |
| US5874324A | Method of sealing electronic component with molded resin | Electricity | 17 | Expired |
| US5768655A | Image forming apparatus and control method thereof | Physics | 16 | Expired |
| US6773247B1 | Die used for resin-sealing and molding an electronic component | Electricity | 14 | Expired |
| US5783220A | Resin sealing and molding apparatus for sealing electronic parts | Performing Operations; Transporting | 10 | Expired |
| US5153708A | Tape carrier used in tab system | Electricity | 7 | Expired |
| US4543684A | Apparatus for cleaning plastics forming mold faces | Performing Operations; Transporting | 7 | Expired |
| US5200125A | Method for seal molding electronic components with resin | Performing Operations; Transporting | 6 | Expired |
| US5159666A | Apparatus and a method for enlarging dot matrix data | Physics | 5 | Expired |
| US6438826B2 | Electronic component, method of sealing electronic component with resin, and apparatus therefor | Emerging Cross-Sectional Technologies | 5 | Expired |
| US6919223B2 | Method of manufacturing semiconductor resin molding and resin member employed therefor | Electricity | 4 | Expired |
| US6736703B2 | Cutting apparatus and cutting method | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6712674B2 | Polishing apparatus and polishing method | Performing Operations; Transporting | 2 | Expired |
| US7738830B2 | Image forming apparatus, image forming system and computer program of the same for forming cover sheet | Performing Operations; Transporting | 2 | Active |
| US6594889B1 | Method for processing leadframe | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6258628A | Method and apparatus for processing resin sealed lead frame | Emerging Cross-Sectional Technologies | 1 | Expired |
| US8139252B2 | Image forming system and image forming method | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.