Semiconductor device
US4724472A · kind A · utility
40Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 1987 |
| Grant date | Feb 9, 1988 |
| Priority date | — |
| Expiry date | Jan 14, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device to be mounted on a circuit board, including a semiconductor chip, a package for mounting the semiconductor chip, a plurality of conductor pads provided on the outer surface of the package, and a plurality of conductor pins, connected to the conductor pads in a substantially vertical contact condition, for connecting to the circuit board in accordance with a contacting condition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.