Semiconductor device
US4725878A · kind A · utility
25Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 1986 |
| Grant date | Feb 16, 1988 |
| Priority date | — |
| Expiry date | Mar 27, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10969
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device provided with signal lines which connect a chip, provided at a top portion of a package, with external terminals provided at a bottom portion of the package. The signal lines have portions formed along side surfaces of the package. Ground surfaces are formed at predetermined distances on two sides of the high-speed signal lines. A coplanar waveguide is formed by the high-speed signal lines and the ground surfaces, so the impedance of vertical portions of the high-speed signal lines is matched to the circuits connected thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.