Method for imaging printed circuit board component leads
US4728195A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 19, 1986 |
| Grant date | Mar 1, 1988 |
| Priority date | — |
| Expiry date | Mar 19, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0815
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention provides a novel system for imaging a component lead on an assembled printed circuit board. The system incorporates a light source for illuminating a substantial portion of a solder pad of the circuit board being inspected. A photoreceptor receives emissions reflected from the illuminated portion of said solder pad and generates an image representative thereof. This photoreceptor is arranged so that passage of a component lead through the component hole occludes or shadows a portion of the solder pad from which the photoreceptor would otherwise receive reflected emissions. The system has application in the testing of printed circuit boards prior to wave soldering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.