Programmable thermal emulator test die
US4730160A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 1986 |
| Grant date | Mar 8, 1988 |
| Priority date | — |
| Expiry date | Mar 20, 2006 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N25/18
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A novel test die for emulating the thermal characteristics of functional product dies includes a plurality of concentric emulator ring configurations fabricated about the die center, each having a plurality of heating resistors approximately forming a rectangle, a plurality of sense diodes located in proximity to the heating resistors and a plurality of hot spot resistors located in proximity to both the heating resistors and the sense diodes. Metallic interconnections are formed on the die which selectively provide each of the heating resistors and hot spot resistors with excitation signals and present signals from the sense diodes indicative of the voltage thereacross.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.