Method for manufacture of printed circuit boards
US4732649A · kind A · utility
7Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 1986 |
| Grant date | Mar 22, 1988 |
| Priority date | — |
| Expiry date | Jun 18, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0361
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of preparing printed circuit boards is described in which the solder mask is applied over a thin layer of copper oxide covering the copper circuit traces, the copper oxide layer being that which remains after stripping the tin or tin-lead allow etch resist.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.