Adhesion promoting product and process for treating an integrated circuit substrate
US4732858A · kind A · utility
50Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 1986 |
| Grant date | Mar 22, 1988 |
| Priority date | — |
| Expiry date | Sep 17, 2006 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0751
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An improved method for improving the adhesion of microelectronic coatings to substrates uses a new silane adhesion promoter and hydroxylic solvent combination. An improved silane adhesion promoter contains an aqueous solvent composition containing a hydroxylic solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.