Ceramic wiring substrate and process for producing the same
US4734233A · kind A · utility
8Cited by
17References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 27, 1987 |
| Grant date | Mar 29, 1988 |
| Priority date | — |
| Expiry date | Jan 27, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ceramic wiring substrate and a process for producing the same having a conductive layer, obtained by sintering a conductive paste comprising 85 to 97% by weight of a tungsten powder and 15 to 3% by weight of a sintering additive (for conductive metal) having a specified composition, on a mullite ceramic substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.