Naoya Kanda
34Patents
15h-index
74Co-inventors
84Inventor score
Filing activity: Apr 2, 1986 → Sep 19, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5086337A | Connecting structure of electronic part and electronic device using the structure | Emerging Cross-Sectional Technologies | 134 | Expired |
| US6780748B2 | Method of fabricating a wafer level chip size package utilizing a maskless exposure | Emerging Cross-Sectional Technologies | 91 | Expired |
| US6791178B2 | Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices | Electricity | 48 | Expired |
| US6610934B2 | Semiconductor module and method of making the device | Electricity | 46 | Expired |
| US4963974A | Electronic device plated with gold by means of an electroless gold plating solution | Emerging Cross-Sectional Technologies | 43 | Expired |
| US5089104A | Method and apparatus for forming a multiple-element thin film based on ion beam sputtering | Chemistry; Metallurgy | 41 | Expired |
| US5811877A | Semiconductor device structure | Electricity | 40 | Expired |
| US4922377A | Module and a substrate for the module | Electricity | 26 | Expired |
| US5476726A | Circuit board with metal layer for solder bonding and electronic circuit device employing the same | Emerging Cross-Sectional Technologies | 26 | Expired |
| US6153938A | Flip-chip connecting method, flip-chip connected structure and electronic device using the same | Electricity | 23 | Expired |
| US6930388B2 | Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure | Electricity | 22 | Expired |
| US6770547B1 | Method for producing a semiconductor device | Electricity | 22 | Expired |
| US5202151A | Electroless gold plating solution, method of plating with gold by using the same, and electronic device plated with gold by using the same | Chemistry; Metallurgy | 20 | Expired |
| US6624504B1 | Semiconductor device and method for manufacturing the same | Electricity | 17 | Expired |
| US6822317B1 | Semiconductor apparatus including insulating layer having a protrusive portion | Electricity | 17 | Expired |
| US6589802B1 | Packaging structure and method of packaging electronic parts | Emerging Cross-Sectional Technologies | 15 | Expired |
| US5191624A | Optical information storing apparatus and method for production of optical deflector | Physics | 12 | Expired |
| US7057283B2 | Semiconductor device and method for producing the same | Electricity | 12 | Expired |
| US7141451B2 | Wireless communication medium and method of manufacturing the same | Electricity | 11 | Expired |
| US4734233A | Ceramic wiring substrate and process for producing the same | Emerging Cross-Sectional Technologies | 8 | Expired |
| US5178738A | Ion-beam sputtering apparatus and method for operating the same | Chemistry; Metallurgy | 6 | Expired |
| US8009047B2 | RFID tag | Physics | 6 | Active |
| US8035522B2 | RFID tag | Physics | 5 | Active |
| US4817276A | Process for producing ceramic substrates for microelectronic circuits | Emerging Cross-Sectional Technologies | 5 | Expired |
| US7002250B2 | Semiconductor module | Electricity | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.