Vertical thermal processor
US4738618A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 1987 |
| Grant date | Apr 19, 1988 |
| Priority date | — |
| Expiry date | May 14, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/14
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Vertically oriented thermal processor, also known as a vertical diffusion furnace for the processing of silicon or gallium arsenide wafers or substrates including a vertically positionable furnace assembly, and a quartz bell-jar shaped element which positions coaxially over and about another quartz bell jar like vertically positionable process tube forming a dual wall contamination barrier. The furnace and the process tube bell jar can be moved up and down pneumatically as a unit or independently of one another during processing modes. Pneumatic cylinders provide for the lifting of the furnace element away from the wafers to ramp temperatures downwardly at an accelerated rate. An overhead track positions for accelerated removal of the furnace and process tube to the exterior of the cabinet without disconnection of electrical, pneumatic or gas connections for maintenance or component changeout. A microprocessor controls and monitors all functions of the vertical thermal processor, and includes a rear microprocessor control as well as a front panel control. Silicon wafer loads can be loaded from the front, side or back by manual, softlander or robotic means.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.