Patent · US Expired

Process and apparatus for abrasive machining of a wafer-like workpiece

US4739589A · kind A · utility

69Cited by

7References

7Claims

0Family size

Assignee

Wacker-Chemitronic Gesellschaft fur Elektronik Grundstoffe mbH · DE

Inventors

Gerhard Brehm · Emmerting, DE
Ingo Haller · Burghausen, DE
Otto Rothenaicher · Zeilarn, DE
Karl-Heinz Langsdorf · Burghausen, DE

Key dates

Filing date	Jul 2, 1986
Grant date	Apr 26, 1988
Priority date	—
Expiry date	Jul 2, 2006

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB24B37/08
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A process is provided for bilateral abrasive machining of wafer-like workpieces, especially semiconductor wafers. The process uses carrier disks in which the outer periphery on which the driving forces mesh, is made of a material having a tensile strength of at least 100 N/mm.sup.2, while in the area that comes into contact with the workpieces to be machined, there is provided a plastic material having an elasticity modulus of from 1.0 to 8.10.sup.4 N/mm.sup.2.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.