Gerhard Brehm
10Patents
7h-index
17Co-inventors
59Inventor score
Filing activity: Jul 2, 1986 → Jul 9, 1996
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4739589A | Process and apparatus for abrasive machining of a wafer-like workpiece | Performing Operations; Transporting | 69 | Expired |
| US4968381A | Method of haze-free polishing for semiconductor wafers | Electricity | 48 | Expired |
| US4973563A | Process for preserving the surface of silicon wafers | Electricity | 34 | Expired |
| US4971654A | Process and apparatus for etching semiconductor surfaces | Electricity | 31 | Expired |
| US4844047A | Process for sawing crystal rods or blocks into thin wafers | Performing Operations; Transporting | 20 | Expired |
| US4811722A | Process for sharpening cutting-off tools and cutting-off process | Performing Operations; Transporting | 13 | Expired |
| US5710077A | Method for the generation of stacking-fault-induced damage on the back of semiconductor wafers | Electricity | 7 | Expired |
| US5030910A | Method and apparatus for slicing crystalline wafers aided by magnetic field monitoring means | Emerging Cross-Sectional Technologies | 6 | Expired |
| US4900363A | Method and liquid preparation for removing residues of auxiliary sawing materials from wafers | Chemistry; Metallurgy | 5 | Expired |
| US5164323A | Process for the surface treatment of semiconductor slices | Electricity | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.