Ceramic combined cover
US4746583A · kind A · utility
30Cited by
7References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 21, 1986 |
| Grant date | May 24, 1988 |
| Priority date | — |
| Expiry date | Nov 21, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12896
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A combination ceramic sealing cover for a semiconductor package has a flat ceramic lid member with metallization applied as a foundation for a seal ring or frame portion. On the metallized layer is a gold-tin solder layer, in the form of either a solder ring that is tack welded on, or solder paste that is screened onto the base metallization and furnace reflowed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.