INDIUM CORPORATION
41Patents
40Active
41Granted
55Portfolio score
Filing activity: Nov 21, 1986 → Mar 24, 2023 · 4 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4746583A | Ceramic combined cover | Emerging Cross-Sectional Technologies | 30 | Expired |
| US8348139B2 | Composite solder alloy preform | Emerging Cross-Sectional Technologies | 13 | Active |
| US8061578B2 | Solder preform | Performing Operations; Transporting | 7 | Active |
| US9468136B2 | Low void solder joint for multiple reflow applications | Emerging Cross-Sectional Technologies | 6 | Active |
| US10943796B2 | Semiconductor device assembly having a thermal interface bond between a semiconductor die and a passive heat exchanger | Electricity | 2 | Active |
| US9741676B1 | Tin-indium based low temperature solder alloy | Electricity | 2 | Active |
| US11267080B2 | Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders | Electricity | 2 | Active |
| US9190377B2 | Metal coating for indium bump bonding | Electricity | 1 | Active |
| US10943795B2 | Apparatus and methods for creating a thermal interface bond between a semiconductor die and a passive heat exchanger | Electricity | 1 | Active |
| US10607857B2 | Semiconductor device assembly including a thermal interface bond between a semiconductor die and a passive heat exchanger | Electricity | 1 | Active |
| US9260768B2 | Lead-free solder alloys and solder joints thereof with improved drop impact resistance | Chemistry; Metallurgy | 1 | Active |
| US10888958B2 | Hybrid high temperature lead-free solder preform | Performing Operations; Transporting | 1 | Active |
| US9175368B2 | MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliability | Chemistry; Metallurgy | 1 | Active |
| US9636784B2 | Mixed alloy solder paste | Emerging Cross-Sectional Technologies | 1 | Active |
| US10328533B2 | Hybrid lead-free solder wire | Chemistry; Metallurgy | 0 | Active |
| US12042864B2 | Thermally decomposing build plate with casting mold for facile release of 3D printed objects | Performing Operations; Transporting | 0 | Active |
| US11807536B2 | Method for preparing graphite sheets with piercing treatment to enhance thermal conduction | Performing Operations; Transporting | 0 | Active |
| US9802274B2 | Hybrid lead-free solder wire | Chemistry; Metallurgy | 0 | Active |
| US11602808B2 | Solder preform with internal flux core including thermochromic indicator | Performing Operations; Transporting | 0 | Active |
| US10756039B2 | Fluxes effective in suppressing non-wet-open at BGA assembly | Electricity | 0 | Active |
| US9875983B2 | Nanomicrocrystallite paste for pressureless sintering | Electricity | 0 | Active |
| US11766721B2 | Thermally decomposing build plate for facile release of 3D printed objects | Emerging Cross-Sectional Technologies | 0 | Active |
| US10118260B2 | Mixed alloy solder paste | Emerging Cross-Sectional Technologies | 0 | Active |
| US12240060B2 | SnIn solder alloys | Performing Operations; Transporting | 0 | Active |
| US9017446B2 | Mixed alloy solder paste | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.