Metal etching process with etch rate enhancement
US4747907A · kind A · utility
36Cited by
14References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 1986 |
| Grant date | May 31, 1988 |
| Priority date | — |
| Expiry date | Oct 29, 2006 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23F1/16
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A metal etching process involving an oxidation-reduction reaction where the metal being etched is oxidized and the active ingredient in the etchant solution is reduced, incorporates contacting said metal with an etching solution containing an active ingredient selected from the group consisting of ferric ions, ferricyanide ions, ceric ions, chromate ions, dichromate ions, and iodine, and introducing ozone into said etching solution to rejuvenate and agitate the solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.