Inventor · Hopewell Junction, NY, US

John Acocella

15Patents
12h-index
55Co-inventors
77Inventor score

Filing activity: Oct 14, 1983 → May 1, 1996

Most-cited inventions

PatentTitleAreaCited byStatus
US5591941A Solder ball interconnected assembly Emerging Cross-Sectional Technologies 133 Expired
US5294830A Apparatus for indirect impingement cooling of integrated circuit chips Electricity 69 Expired
US5675889A Solder ball connections and assembly process Emerging Cross-Sectional Technologies 53 Expired
US5108541A Processes for electrically conductive decals filled with inorganic insulator material Electricity 47 Expired
US4753694A Process for forming multilayered ceramic substrate having solid metal conductors Electricity 37 Expired
US4747907A Metal etching process with etch rate enhancement Chemistry; Metallurgy 36 Expired
US4879156A Multilayered ceramic substrate having solid non-porous metal conductors Emerging Cross-Sectional Technologies 33 Expired
US5338900A Structures for electrically conductive decals filled with inorganic insulator material Electricity 32 Expired
US6504105B1 Solder ball connections and assembly process Emerging Cross-Sectional Technologies 21 Expired
US5135595A Process for fabricating a low dielectric composite substrate Electricity 19 Expired
US5031029A Copper device and use thereof with semiconductor devices Emerging Cross-Sectional Technologies 18 Expired
US5139851A Low dielectric composite substrate Emerging Cross-Sectional Technologies 16 Expired
US5277725A Process for fabricating a low dielectric composite substrate Electricity 10 Expired
US4620863A Radiation coloration resistant glass Chemistry; Metallurgy 7 Expired
US5167913A Method of forming an adherent layer of metallurgy on a ceramic substrate Emerging Cross-Sectional Technologies 5 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.