Plating bath for electrodeposition of aluminum and process for the same
US4747916A · kind A · utility
15Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 3, 1987 |
| Grant date | May 31, 1988 |
| Priority date | — |
| Expiry date | Sep 3, 2007 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/44
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In a plating bath for electrodeposition of aluminum, comprising a nonaqueous electrolyte using a eutectic mixture fusible at room temperature, the plating bath comprises a mixture of about 40 to 80 mol % of an aluminum halide and about 20 to 60 mol % of butyl pyridinium halide, or further comprises an organic solvent mixed in said mixture. This plating bath may not cause any color change of a coating into gray or black to assure white and uniform appearance, even when current density is increased to 30 A/dm.sup.2 or varied in the range from 0.1 to 30 A/dm.sup.2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.