Inventor · Ichikawa, JP

Setsuko Takahashi

6Patents
4h-index
11Co-inventors
43Inventor score

Filing activity: Sep 3, 1987 → Jun 21, 1991

Most-cited inventions

PatentTitleAreaCited byStatus
US4904355A Plating bath for electrodeposition of aluminum and plating process making use of the bath Chemistry; Metallurgy 15 Expired
US4747916A Plating bath for electrodeposition of aluminum and process for the same Chemistry; Metallurgy 15 Expired
US5135825A Method for producing ambient temperature molten salt consisting of certain pyridinium and imidazolium halides and an aluminum trihalide Emerging Cross-Sectional Technologies 13 Expired
US4906342A Plating bath for electrodeposition of aluminum and plating process making use of the bath Chemistry; Metallurgy 7 Expired
US5074973A Non-aqueous electrolytic aluminum plating bath composition Chemistry; Metallurgy 3 Expired
US5141615A Aluminum electroplating apparatus Chemistry; Metallurgy 3 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.