Selective metallization process and additive method for manufactured printed circuit boards
US4748104A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 10, 1986 |
| Grant date | May 31, 1988 |
| Priority date | — |
| Expiry date | Nov 10, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1415
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process for selective metallization of a substrate in a predetermined desired pattern, and particularly for the manufacture of printed circuit boards, in which a substrate patterned in desired manner with resist material is treated with conditioning agent, adjuvant and deactivating agent preparatory to catalytic activation and electroless deposit of metal flash. By proceeding in this manner, adherent flash metal deposit is achieved on non-resist areas without encountering significant plating on resist areas. Following metal flash deposit, the resist can be easily and cleanly stripped and additional metal then built up on the flash metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.