Decoupling capacitor and method of formation thereof
US4748537A · kind A · utility
24Cited by
9References
63Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 8, 1987 |
| Grant date | May 31, 1988 |
| Priority date | — |
| Expiry date | Sep 8, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/435
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A hermetically sealed and automatically insertable decoupling capacitor for use in conjunction with integrated circuit DIP inserter devices having a multi-layer ceramic capacitor chip provided with conductive electrodes on the top and bottom surfaces thereof sandwiched between suitable conductive strips and insulating layers and retained within an opening formed in an insulating strip by solder or conductive adhesive. The multi-layer ceramic capacitor further includes conductive end terminations having insulative caps thereon to prevent shorting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.