Jorge M. Hernandez
31Patents
21h-index
15Co-inventors
82Inventor score
Filing activity: Jan 10, 1983 → Nov 16, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5095402A | Internally decoupled integrated circuit package | Electricity | 114 | Expired |
| US5065281A | Molded integrated circuit package incorporating heat sink | Electricity | 77 | Expired |
| US5272590A | Integrated circuit package having an internal cavity for incorporating decoupling capacitor | Electricity | 71 | Expired |
| US5065284A | Multilayer printed wiring board | Electricity | 70 | Expired |
| USRE35733E | Device for interconnecting integrated circuit packages to circuit boards | General | 69 | Expired |
| USRE35064E | Multilayer printed wiring board | General | 67 | Expired |
| US4994936A | Molded integrated circuit package incorporating decoupling capacitor | Emerging Cross-Sectional Technologies | 58 | Expired |
| US4667267A | Decoupling capacitor for pin grid array package | Electricity | 57 | Expired |
| US5832598A | Method of making microwave circuit package | Emerging Cross-Sectional Technologies | 57 | Expired |
| US4706162A | Multilayer capacitor elements | Electricity | 44 | Expired |
| US4853826A | Low inductance decoupling capacitor | Electricity | 38 | Expired |
| US4989117A | Molded integrated circuit package incorporating thin decoupling capacitor | Emerging Cross-Sectional Technologies | 36 | Expired |
| US4734818A | Decoupling capacitor for surface mounted leadless chip carriers, surface mounted leaded chip carriers and Pin Grid Array packages | Electricity | 34 | Expired |
| US4734819A | Decoupling capacitor for surface mounted leadless chip carrier, surface mounted leaded chip carrier and pin grid array package | Emerging Cross-Sectional Technologies | 31 | Expired |
| US5707575A | Method for filling vias in ceramic substrates with composite metallic paste | Electricity | 27 | Expired |
| US4908258A | High dielectric constant flexible sheet material | Emerging Cross-Sectional Technologies | 27 | Expired |
| US5034850A | Thin decoupling capacitor for mounting under integrated circuit package | Electricity | 27 | Expired |
| US4748537A | Decoupling capacitor and method of formation thereof | Emerging Cross-Sectional Technologies | 24 | Expired |
| US4475143A | Decoupling capacitor and method of manufacture thereof | Emerging Cross-Sectional Technologies | 23 | Expired |
| US4626958A | Decoupling capacitor for Pin Grid Array package | Emerging Cross-Sectional Technologies | 22 | Expired |
| US6426686B1 | Microwave circuit packages having a reduced number of vias in the substrate | Electricity | 22 | Expired |
| US4853827A | High dielectric multilayer capacitor | Electricity | 21 | Expired |
| US5422782A | Multiple resonant frequency decoupling capacitor | Electricity | 20 | Expired |
| US4754366A | Decoupling capacitor for leadless surface mounted chip carrier | Electricity | 20 | Expired |
| US4594641A | Decoupling capacitor and method of formation thereof | Emerging Cross-Sectional Technologies | 13 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.