Process for forming multilayered ceramic substrate having solid metal conductors
US4753694A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 2, 1986 |
| Grant date | Jun 28, 1988 |
| Priority date | — |
| Expiry date | May 2, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayered ceramic (MLC) substrate having embedded and exposed conductors suitable for mounting and interconnecting a plurality of electronic devices exterior thereof. The horizontal planar conductors comprise substantially a plurality of solid, non-porous, homogeneous metal patterns, whereas the vertical interplanar connection conductors are substantially porous metal conductors that are formed by methods such as screening. The process to form the MLC substrate involves forming a pattern of solid, nonporous conductors to a backing sheet having a release layer, then transferring the pattern to a ceramic green sheet. Zero X-Y shrinkage sintering processes allow the MLC substrate and solid metal conductors to be densified without distortion of the solid metal patterns or the ceramic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.