Variable pitch IC bond pad arrangement
US4753820A · kind A · utility
15Cited by
5References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 20, 1986 |
| Grant date | Jun 28, 1988 |
| Priority date | — |
| Expiry date | Oct 20, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The bond pads (22) for a ceramic package (10) are deposited on the pre-fired ceramic with the bond pad widths (47) increasing as a function of the distance (49) of each pad from the center of package mass (40), whereby bond pads at the extremity (36) of the package have the largest pad width and pads toward the center (40) of the package have the narrowest width.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.