Split-level CMOS
US4754314A · kind A · utility
20Cited by
2References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 28, 1987 |
| Grant date | Jun 28, 1988 |
| Priority date | — |
| Expiry date | Jan 28, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D88/01
Abstract
A CMOS device wherein the NMOS devices are bulk devices and the PMOS devices are SOI devices. The PMOS devices are formed with their channel regions in a silicon-on-insulator layer, preferably a laterally recrystallized annealed-polysilicon layer over a silicon dioxide layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.