Apparatus and methods for semiconductor wafer testing
US4755746A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 24, 1985 |
| Grant date | Jul 5, 1988 |
| Priority date | — |
| Expiry date | Apr 24, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An automatic system for performing sheet resistivity testing on surface layers of semiconductor wafers, including a wafer handling stage having a platform for carrying a semiconductor wafer, and an arrangement for mounting the platform for rotation about a central axis and for translation of the platform orthogonal to a major surface thereof. A platform drive translates the platform between a wafer test position and a wafer load position, and a stage drive rotates the platform to accurately located angular test positions. A probe handling arrangement includes a carriage for carrying a test probe parallel to the major surface of a wafer on the platform and a carriage drive translates the carriage between a parked position in which a test prove thereon is positioned adjacent and clear of the platform and accurately located test positions along a radius of the platform. The carriage carries a resistivity test probe which includes test probe element for contacting the surface of a semiconductor wafer. A light tight housing surrounds the platform and includes an access door therein facing the platform and positioned intermediate the wafer load position and the wafer test position of the…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.